Carrier tape system and methods of using carrier tape system

A method for removing semiconductor devices from a pocket of a carrier tape, the method comprising:

• separating a cover tape (210) from a carrier tape substrate (204), the carrier tape substrate having a width and a length, a plurality of pockets (206) each containing at least one of the semicondcutor devices, a plurality of non-adhesion areas (251) arranged in a first row along the length of the carrier tape substrate and a plurality of non-adhesion areas (251) arranged in a second row along the length of the carrier tape substrate, the first row of non-adhesion areas located on one side of the plurality of pockets and the second row of non-adhesion areas located on a side of the plurality of pockets different from the side of the plurality of pockets where the first row of non-adhesion areas is located;
• separating the cover tape from the carrier tape substrate at one or more of the plurality of non-adhesion areas;
• separating the cover tape from the carrier tape substrate at one or more of a plurality of adhesion areas (250);
• and
• removing the at least one semiconductor device from the plurality of pockets.

A method for removing semiconductor devices from a pocket of a carrier tape, the method comprising:

• separating a cover tape (210) from a carrier tape substrate (204), the carrier tape substrate including a first edge (215) extending along a length of the carrier tape substrate and a second edge (217) extending along the length of the carrier tape substrate and a plurality of pockets (206) between the first edge and the second edge, each pocket containing at least one of the semiconductor devices;
• separating the cover tape from the carrier tape substrate at one or more of a plurality of non-adhesion areas (251) between the plurality of pockets and the first edge of the carrier tape substrate;
• separating the cover tape from the carrier tape substrate at one or more of a plurality of adhesion areas (250) between the plurality of pockets and the first edge of the carrier tape substrate;
• and
• removing the at least one semiconductor device from one of the plurality of pockets.