Semiconductor Device and Method of Manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Jui Kuo, Ming-Tan Lee, Chen-Cheng Kuo, De-Yuan Lu
Life of this patent
Estimating the term…
Abstract
A semiconductor device and method of making a conductive connector is provided. In an embodiment an opening is formed within a photoresist by adjusting the center point of an in-focus area during the exposure process. Once the photoresist has been developed to form an opening, an after development baking process is utilized to reshape the opening. Once reshaped, a conductive material is formed into the opening to take on the shape of the opening.
Claims21
A method of manufacturing a semiconductor device, the method comprising:
- applying a photoresist over a seed layer;
- exposing the photoresist to a patterned energy source, the patterned energy source having an in-focus area with a center point, the center point located below a surface of the photoresist facing towards the seed layer;
- developing the photoresist to form an opening;
- and
- plating an external connector into the opening.
A method of manufacturing a semiconductor device, the method comprising:
- exposing a photoresist to a patterned energy source, the photoresist being located over an encapsulant located between a semiconductor die and a through encapsulant via;
- developing the photoresist to form an opening with a first shape;
- performing a post-development baking process to reshape the opening into a second shape different from the first shape, wherein the second shape comprises a flare near a bottom of the opening;
- and
- plating a conductive material into the opening.
-20. (canceled)
A method of manufacturing a semiconductor device, the method comprising:
- placing a semiconductor die adjacent to a through encapsulant via;
- encapsulating the semiconductor die and the through encapsulant via with an encapsulant, wherein after the encapsulating the through encapsulant via extends from a first side of the encapsulant to a second side of the encapsulant;
- placing a passivation layer over the encapsulant;
- and
- forming an external connector over the encapsulant, the external connector comprising:
- a first portion with a first width, the first portion extending through the passivation layer;
- a second portion with a second width larger than the first width, the second portion being located outside of the passivation layer;
- and
- a tapered portion extending from the second portion to the first portion.
Dependencies are inferred from the claim text.