Method for manufacturing wafer

A method for manufacturing a wafer as a product, comprising the steps of:

• grinding and chamfering a circumferential edge portion of a wafer sliced from a single crystal ingot;
• lapping or double-side grinding main surfaces of the chamfered wafer;
• etching the lapped or double-side ground wafer;
• one-side or double-side mirror-polishing main surfaces of the etched wafer;
• and
• mirror-polishing a chamfered portion of the mirror-polished wafer, wherein
• after the chamfering step, the chamfered portion of the wafer has a cross-sectional shape comprising:
• a first inclined portion continuous from a first main surface, which is one of the main surfaces of the wafer, and inclined from the first main surface;
• a first arc portion which is an arc-shaped portion continuous from the first inclined portion and has a radius of curvature;
• a second inclined portion continuous from a second main surface, which is another main surface of the wafer, and inclined from the second main surface;
• a second arc portion which is an arc-shaped portion continuous from the second inclined portion and has a radius of curvature;
• and
• an end portion which connects the first arc portion to the second arc portion and constitutes an outermost circumferential end portion of the wafer,
• in the chamfering, the wafer to be a product is chamfered such that the chamfered wafer are smaller than a target value range of the wafer product, and
• in the mirror-polishing of the chamfered portion, the chamfered portion is mirror-polished such that the mirror-polished chamfered portion are within the target value range of the wafer product to thus manufacture the wafer product.