US 2020/0006005 A1 · PATTERNING OF THIN FILM CAPACITORS IN ORGANIC SUBSTRATE PACKAGES

Abstract

Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.

Claims20

Dependent claims

A package comprising:

a thin film capacitor (TFC) sheet with a first side and a second side opposite the first side, wherein the first side is to couple with a first side of a substrate;
wherein the first side of the TFC sheet and the second side of the TFC sheet are metal layers separated by a dielectric layer;
and
wherein at least one of the metal layers of the TFC sheet is patterned.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

16/024,715Filed 29 Jun 2018

Published

2 Jan 2020

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

H01G 4/33
Fixed capacitors; Processes of their manufacture: thin- or thick-film capacitors
H10D 1/00
Resistors, capacitors or inductors
H10D 1/68
Capacitors: capacitors having no potential barriers
H10D 1/682
Capacitors having no potential barriers: having dielectrics comprising perovskite structures

Patterning of thin film capacitors in organic substrate packages

Life of this patent

Patterning of thin film capacitors in organic substrate packages

Life of this patent

Abstract

Claims20