Multilayer electronic component and board having the same mounted thereon

A multilayer electronic component comprising:

• a first body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, one ends of the first and second internal electrodes being exposed through the third and fourth surfaces, respectively;
• a second body bonded to the first body, including alumina, and having seventh and eighth surfaces opposing each other, ninth and tenth surfaces connected to the seventh and eighth surfaces and opposing each other, and eleventh and twelfth surfaces connected to the seventh and eighth surfaces, connected to the ninth and tenth surfaces and opposing each other, the first surface of the first body and the eighth surface of the second body facing each other;
• a first plating layer extending from a portion of the second surface of the body to a portion of seventh surface of the second body, and covering the third surface of the body and the ninth surface of the second body;
• and
• a second plating layer extending from another portion of the second surface of the body to another portion of seventh surface of the second body, and covering the fourth surface of the body and the tenth surface of the second body.