Integrated magnetic core inductors on glass core substrates
AssigneeIntel Corporation
InventorsKrishna Bharath, Adel Elsherbini
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Abstract
A microelectronics package comprising a package core and an inductor over the package core. The inductor comprises a dielectric over the package core. The dielectric comprises a curved surface opposite the package core. At least one conductive trace is adjacent to the package core. The at least one conductive trace is at least partially embedded within the dielectric and extends over the package core. A magnetic core cladding is over the dielectric layer and at least partially surrounding the conductive trace.
Claims20
A microelectronics package, comprising:
- a package core;
- an inductor structure over the package core, wherein the inductor structure comprises:
- a dielectric over the package core, the dielectric opposite the package core;
- at least one conductive trace-between the dielectric and the package core;
- and
- a magnetic cladding over the dielectric and at least partially surrounding the at least one conductive trace.
The microelectronics package of claim 9, wherein the magnetic core cladding covers the convex surface of the dielectric and extends along the package core between the package core and the dielectric.
A system, comprising:
- a microelectronics package, comprising:
- a package core;
- a die over the package core;
- an inductor over the package core, wherein the inductor comprises:
- a dielectric over the package core, the dielectric comprising a curved surface opposite the package core;
- at least one conductive trace adjacent to the package core, wherein the at least one conductive trace is at least partially embedded within the dielectric, wherein the at least one conductive trace extends over the package core;
- and
- a magnetic core cladding over the dielectric layer and at least partially surrounding the at least one conductive trace;
- wherein the die is coupled to the one or more conductive traces.
A method for making an integrated inductor in a microelectronics package, comprising:
- forming a package core;
- forming a first magnetic core cladding layer over the package core;
- forming one or more conductive traces over the magnetic core cladding layer;
- forming a dielectric layer over the one or more conductive traces;
- and
- forming a second magnetic core cladding layer over the dielectric layer.
Dependencies are inferred from the claim text.