Copper plating solution and copper plating method

A copper plating solution comprising:

• water-soluble copper salt;
• ethylenediamine;
• at least one of ethylenediaminetetraacetic acid (EDTA), a substituted derivative of EDTA, an ethylenediamine derivative, or glycine;
• at least one of hydantoin or a substituted derivative thereof, and
• at least one of hypophosphite or organic salt, and
• wherein:
• the copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper, and
• wherein the at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine has a molar ratio of 0.4 or more and 0.7 or less with respect to the ethylenediamine.