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US 2019/0393654 A1Published application
Unitary molded usb device
AssigneeWestern Digital Technologies, Inc.
InventorsTee Khoon Guan, Pradeep Kumar Rai
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Abstract
A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.
Claims20
A USB device, including:
- a semiconductor device;
- a housing molded around the semiconductor device such that the semiconductor device is encased within the housing, the housing comprising a space above the semiconductor device configured to allow insertion of the USB device into a USB device host slot.
A USB device, including:
- a semiconductor device comprising a plurality of connector pins;
- a housing injection molded around the semiconductor device, the housing engaging the semiconductor device at a plurality of points such that the semiconductor device is fixed within the housing, the housing comprising a space above the plurality of connector pins, the space configured to allow insertion of the USB device into a USB device host slot.
A method of fabricating USB devices, comprising:
- (a) placing a plurality of semiconductor devices in a mold;
- (b) encasing the plurality of semiconductor devices in a molding compound, the molding compound comprising a space above each of the plurality of semiconductor devices;
- and
- (c) separating the encased plurality of semiconductor devices into individual USB devices.
1 more element
A USB device, including:
- a semiconductor device means for storing data;
- housing means for encasing the semiconductor device such that the semiconductor device is encased within the housing, the housing means comprising a space above the semiconductor device configured to allow insertion of the USB device into a USB device host slot.
Dependencies are inferred from the claim text.