Stepped Component Assembly Accommodated Within a Stepped Cavity in Component Carrier
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsGernot Grober, Sabine Liebfahrt, Christian Vockenberger
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Abstract
An electronic package includes a component carrier having a stepped cavity formed therein; and a component assembly having at least two electrically connected electronic components with different sizes such that the component assembly has a stepped shape. The component assembly is accommodated at least partially inserted within the stepped cavity. Further described is a method of manufacturing such an electric package.
Claims15
An electronic package, comprising:
- a component carrier having a stepped cavity formed therein;
- and
- a component assembly with at least two electrically connected electronic components having different sizes such that the component assembly has a stepped shape;
- wherein the component assembly is accommodated at least partially inserted within the stepped cavity.
The electronic package as set forth in the preceding claim, wherein at least one of the at least two electronic components is a semiconductor chip, a substrate, an interposer, or a through silicon via connection.
A method of manufacturing an electronic package, the method comprising:
- forming a component carrier with a stepped cavity;
- providing a component assembly comprising at least two electrically connected electronic components having different sizes such that the component assembly has a stepped shape;
- and
- inserting the component assembly in the stepped cavity such that the component assembly is accommodated at least partially within the stepped cavity.
The method as set forth in the preceding claim, wherein forming a component carrier comprises:
- providing a first component carrier portion having a first opening formed therein, wherein the first opening corresponds to a narrower portion of a stepped cavity, which comprises the first opening and a second opening corresponding to a wider portion of the stepped cavity;
- providing a second component carrier portion;
- and
- attaching the two component carrier portions to each other.
The method as set forth in the preceding claim, wherein the provided second component carrier portion has the second opening or
- the second opening is formed within the second component carrier portion after attaching the two component carrier portions to each other.
Dependencies are inferred from the claim text.