Back to results
US 2019/0380207 A1Published application
Tape wiring board and semiconductor device
AssigneeSharp Kabushiki Kaisha
InventorNOBUAKI ASAYAMA
Life of this patent
Estimating the term…
Abstract
A tape wiring board includes an insulating film on which a semiconductor chip is mounted and metal layers formed on both principal surfaces, respectively, of the insulating film. That one of the metal layers which is formed on a first surface that is one principal surface of the insulating film and on which the semiconductor chip is mounted has a first electrode that is placed near substantially the center of a region on the first surface where the semiconductor chip is mounted.
Claims12
A tape wiring board comprising:
- an insulating film on which a semiconductor chip is mounted;
- and
- metal layers formed on both principal surfaces, respectively, of the insulating film,
- wherein that one of the metal layers which is formed on a first surface that is one principal surface of the insulating film and on which the semiconductor chip is mounted has a first electrode that is placed near substantially a center of a region on the first surface where the semiconductor chip is mounted.
1 more element
A semiconductor device comprising:
- a semiconductor chip;
- and
- an insulating film on which the semiconductor chip is mounted and on both principal surfaces of which metal layers are formed, respectively,
- wherein the semiconductor chip has a semiconductor connection terminal located near substantially a center of a surface of the semiconductor chip that faces the insulating film, and
- that one of the metal layers which is formed on a first surface that is one of the principal surfaces of the insulating film and on which the semiconductor chip is mounted has a first electrode, located near substantially a center of a region on the first surface where the semiconductor chip is mounted, that is connected to the semiconductor connection terminal.
2 more elements
Dependencies are inferred from the claim text.