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US 2019/0380202 A1Published application
Printed wiring board and method for manufacturing printed wiring board
AssigneeMitsubishi Electric Corporation
InventorsShunsuke SASAKI, Kohei SATO, Yusuke MORIMOTO
Life of this patent
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Abstract
A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.
Claims15
A printed wiring board comprising:
- a main substrate having a top surface, a bottom surface, a slit penetrating from the top surface to the bottom surface, and a plurality of first electrodes provided on the bottom surface;
- and
- a rising substrate having a support portion and a plurality of second electrodes provided in the support portion and connected to the plurality of first electrodes, respectively, using solder,
- the support portion of the rising substrate being inserted into the slit in the main substrate,
- in a direction in which the plurality of first electrodes are aligned, a width of each of the plurality of first electrodes being larger than a width of each of the plurality of second electrodes, the width of each of the plurality of second electrodes being arranged to fit within the width of each of the plurality of first electrodes.
2 more elements
(canceled)
Dependencies are inferred from the claim text.