Embedded component structure and manufacturing method thereof

A manufacturing method of an embedded component structure, comprising:

• providing a carrier;
• placing a circuit board on the carrier, wherein the circuit board includes a through hole, and the circuit board comprising:
• a core layer;
• a first circuit layer, disposed on the core layer;
• and
• a second circuit layer, disposed on the core layer opposite to the first circuit layer, wherein the through hole at least penetrates the first circuit layer and the core layer;
• placing an electronic component on the carrier, wherein the electronic component includes a plurality of connection pads, and the connection pads contact the carrier;
• forming a dielectric material layer on the carrier after the circuit board and the electronic component are placed on the carrier and the electronic component is embedded in the through hole, the dielectric material layer is at least filled in the through hole, and the Young's modulus of the core layer is greater than the Young's modulus of the dielectric material layer;
• removing the carrier to expose the first circuit layer and the connection pads, wherein a first electrical connection surface of the first circuit layer is coplanar with a second electrical connection surface of each of the connection pads;
• and
• forming a connection circuit layer after the carrier is removed, wherein the connection circuit layer covers and contacts the first electrical connection surface and the at least one of the second electrical connection surfaces.