Acoustic resonator package and method of fabricating the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Kyung LEE, Kwang Su KIM, Sang Jin KIM, Seung Wook PARK, Jong Beom KIM
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Abstract
An acoustic resonator package includes a substrate, an acoustic resonator disposed on the substrate, the acoustic resonator including a first hydrophobic layer, a cap configured to accommodate the acoustic resonator, a bonding portion configured to bond the substrate to the cap, and a second hydrophobic layer disposed on the substrate at a position between the acoustic resonator and the bonding portion.
Claims20
An acoustic resonator package comprising:
- a substrate;
- an acoustic resonator disposed on the substrate, the acoustic resonator comprising a first hydrophobic layer;
- a cap configured to accommodate the acoustic resonator;
- a bonding portion configured to bond the substrate to the cap;
- and
- a second hydrophobic layer disposed on the substrate at a position between the acoustic resonator and the bonding portion.
A method of fabricating an acoustic resonator package, the method comprising:
- forming an acoustic resonator on one surface of a substrate;
- forming a first bonding portion on the substrate;
- forming a hydrophobic layer on the acoustic resonator and the substrate;
- and
- bonding a second bonding portion formed on one surface of a cap to the first bonding portion to accommodate the acoustic resonator.
A method of fabricating an acoustic resonator package, the method comprising:
- forming an acoustic resonator on one surface of a substrate;
- forming a blocking layer in an area of the substrate where a bonding portion is to be formed;
- forming a hydrophobic layer on the acoustic resonator and the substrate;
- removing the blocking layer and forming the bonding portion on the substrate;
- and
- bonding a cap to the bonding portion to accommodate the acoustic resonator.
Dependencies are inferred from the claim text.