Laminated electronic component and method of manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorKunihiro MIYAHARA
Life of this patent
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Abstract
A laminated electronic component includes a multilayer body including multiple insulator layers that are laminated and including a bottom surface, a top surface, and multiple side surfaces. The laminated electronic component includes a shield film provided on at least one side surface of the multilayer body. In the laminated electronic component, at least one step difference is provided along a ridge at which the bottom surface and a corresponding one of the side surfaces of the multilayer body are connected to each other, and the shield film includes an edge portion disposed within the at least one step difference.
Claims14
A laminated electronic component comprising:
- a multilayer body including a plurality of insulator layers that are laminated, the multilayer body including a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface to each other;
- and
- a shield film provided on at least one of the side surfaces of the multilayer body;
- wherein
- at least one step difference is provided along a ridge at which the bottom surface and the at least one of the side surfaces of the multilayer body are connected to each other;
- and
- the shield film includes an edge portion disposed within the at least one step difference.
A method of manufacturing a laminated electronic component, the method sequentially comprising:
- a step of providing an unsintered multilayer body including a bottom surface, a top surface, and a plurality of side surfaces that connect the bottom surface and the top surface to each other and in which a plurality of ceramic green sheets are laminated and resin paste is applied on the bottom surface along peripheral edges thereof;
- a step of pushing the resin paste into the bottom surface;
- a step of firing the unsintered multilayer body to form a multilayer body in which at least one step difference is formed along a ridge at which the bottom surface and a corresponding one of the side surfaces are connected to each other;
- and
- a step of forming a shield film on the corresponding one of the side surfaces of the multilayer body, the shield film including an edge disposed within the at least one step difference.
Dependencies are inferred from the claim text.