Amplifiers and amplifier modules having stub circuits
AssigneeNXP USA, Inc.
InventorsENVER KRVAVAC, JOSEPH GERARD SCHULTZ, YU-TING DAVID WU, NICK YANG
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AssigneeNXP USA, Inc.
InventorsENVER KRVAVAC, JOSEPH GERARD SCHULTZ, YU-TING DAVID WU, NICK YANG
Estimating the term…
An amplifier module is provided. The amplifier module includes a multi-layer printed circuit board (PCB). A first power transistor die is mounted at a top surface of the multi-layer PCB. A second power transistor die is mounted at the top surface of the multi-layer PCB. An impedance inversion element is coupled between an output of the first power transistor die and an output of the second power transistor die. A combining node is formed at the output of the second power transistor die. A stub circuit including a transmission line element is coupled at the combining node.
An amplifier module comprising:
An amplifier module comprising:
(canceled)
(canceled)
A Doherty amplifier comprising:
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Dependencies are inferred from the claim text.