Antenna package and configuration for millimeter wave
AssigneeQUALCOMM Incorporated
InventorsJon LASITER, Ravindra Vaman SHENOY, Mohammad Ali TASSOUDJI, Seong Heon JEONG, Jeremy Darren DUNWORTH
Life of this patent
Estimating the term…
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AssigneeQUALCOMM Incorporated
InventorsJon LASITER, Ravindra Vaman SHENOY, Mohammad Ali TASSOUDJI, Seong Heon JEONG, Jeremy Darren DUNWORTH
Estimating the term…
An antenna package comprising a chip package including a plurality of feed lines, a first half antenna subassembly electrically coupled to the feed lines, and a second half antenna subassembly electrically coupled to the feed lines, wherein the first and second half antenna subassemblies point away from each other in a direction substantially perpendicular to the chip package. The antenna subassemblies may be millimeter (mm) wave antennas covering from approximately 24 to 43.5 GHz. The antenna subassemblies include a flex substrate formed from printed circuit boards (PCB) or flex-film PCB.
An antenna package:
A method for providing an antenna package comprising:
An antenna package:
Dependencies are inferred from the claim text.