Method for manufacturing semiconductor light-emitting device
AssigneeSemicon Light Co., Ltd.
InventorsSoo Kun JEON, Seung Ho BAEK, Da Rae LEE, Bong Hwan KIM, Dong So JUNG
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Abstract
Disclosed is a method for manufacturing a semiconductor light emitting device, the method including: providing a mask having a plurality of openings on a base; placing semiconductor light emitting chips on exposed portions of the base through the openings, respectively, by a device carrier which recognizes a shape of the mask and calibrates position for a semiconductor light emitting chip to be seated; and supplying an encapsulant to each of the openings, with the mask serving as a dam.
Claims13
1-11. (cancelled)
A method for manufacturing a semiconductor light emitting device, the method comprising:
- providing onto a base a dam with openings, and semiconductor light emitting chips lying on exposed portions of the base through the openings, respectively, with cutting grooves being formed on the dam around the openings;
- supplying an encapsulant to each of the openings to cover the semiconductor light emitting chip;
- and
- obtaining an individual separated semiconductor light emitting device by cutting along the cutting grooves, with the separate semiconductor light emitting device being comprised of the semiconductor light emitting chip, the encapsulant and a cut dam portion.
Dependencies are inferred from the claim text.