Method for manufacturing semiconductor light-emitting device
AssigneeSemicon Light Co., Ltd.
InventorsSoo Kun JEON, Seung Ho BAEK, Da Rae LEE, Bong Hwan KIM, Dong So JUNG
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Abstract
Disclosed is a method for manufacturing a semiconductor light emitting device, the method including: providing a mask having a plurality of openings on a base; placing semiconductor light emitting chips on exposed portions of the base through the openings, respectively, by a device carrier which recognizes a shape of the mask and calibrates position for a semiconductor light emitting chip to be seated; and supplying an encapsulant to each of the openings, with the mask serving as a dam.
Claims12
-11. (canceled)
A method for testing a semiconductor light emitting device, the method comprising:
- preparing an assembly of a mask having a plurality of openings, semiconductor light emitting chips, with each of the semiconductor light emitting chips having an electrode and being placed in a corresponding opening, and an encapsulant supplied to each of the openings and arranged to encompass the semiconductor light emitting chip in such a manner to expose the electrode;
- placing optical measuring equipment on the opposite side of the electrode, with the optical measuring equipment receiving light from the semiconductor light emitting chips;
- and
- measuring the light from the semiconductor light emitting chips using the optical measuring equipment, wherein the mask around the semiconductor light emitting chips reflects a portion of the light from the semiconductor light emitting chips towards the optical measuring equipment and blocks the light from entering a neighboring encapsulant, allowing the light from the semiconductor light emitting chips to be measured by the optical measuring equipment.
Dependencies are inferred from the claim text.