Semiconductor Device and Method

A method comprising:

• connecting a first structure to an interconnect, the first structure comprising a light emitting diode extending from a carrier substrate, a first terminal of the light emitting diode being connected to the interconnect;
• removing the carrier substrate to expose the light emitting diode;
• encapsulating the light emitting diode with a photosensitive encapsulant;
• after encapsulating the light emitting diode, forming a first conductive via extending through the photosensitive encapsulant to contact the interconnect;
• and
• forming a conductive line connecting a second terminal of the light emitting diode to the first conductive via.

A device comprising:

• an interconnect;
• a light emitting diode connected to the interconnect;
• a photosensitive encapsulant surrounding the light emitting diode;
• a first conductive via extending through the photosensitive encapsulant, the first conductive via being electrically connected to the interconnect, the first conductive via comprising a conductive material on a seed layer, the seed layer being disposed between the conductive material and the interconnect, the seed layer further being disposed between the conductive material and the photosensitive encapsulant;
• and
• a conductive line connecting the light emitting diode to the first conductive via.