Flip-chip light-emitting module
AssigneeAzurewave Technologies, Inc.
InventorsKUNG-AN LIN, CHUNG-CHE YANG, HUNG-WEI LIN, HSIANG-YUN CHENG
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Abstract
A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.
Claims10
A flip-chip light-emitting module, comprising:
- a thermal dissipation substrate;
- a package assembly including a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame, the frame including a conductive path disposed on an inner surface of the frame;
- and
- a light-emitting chip disposed on the thermal dissipation substrate, and including a top conductive contact and a light-emitting surface at the same side, the top conductive contact electrically connected to the conductive path through a conductor;
- wherein the package assembly further includes a filling layer filled between an inner side of the frame and the thermal substrate.
Dependencies are inferred from the claim text.