Semiconductor device and method of manufacturing the same
AssigneeAblic Inc.
InventorHirofumi SHINOHARA
Life of this patent
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AssigneeAblic Inc.
InventorHirofumi SHINOHARA
Estimating the term…
A semiconductor device (1) includes a drain region (14) of a first conductivity type which includes a high-concentration drain region (14a), a first drain drift-region (14b), and a second drain drift-region (14c) of the first conductivity type, a source region (15) of the first conductivity type, a body region (16) of a second conductivity type, a gate insulating film (12), a gate electrode (13), and an STI insulating film (11) formed on the drain region (14). The second drain drift-region (14c) is formed from a first position (11f) of the STI insulating film (11) which is away from a first corner portion (11a) by a distance (x1) in a direction of a second corner portion (11b).
A semiconductor device, comprising:
A method of manufacturing a semiconductor device having a thick insulating film whose thickness is larger than a thickness of a gate insulating film, in a drain region of a first conductivity type formed on a semiconductor substrate, the method comprising:
Dependencies are inferred from the claim text.