Image sensors with multi-photodiode image pixels and vertical transfer gates
AssigneeSemiconductor Components Industries, LLC
InventorManuel H. INNOCENT
Life of this patent
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AssigneeSemiconductor Components Industries, LLC
InventorManuel H. INNOCENT
Estimating the term…
Image sensors may include an array of pixels each having nested sub-pixels. Nested sub-pixels may include an inner photosensitive region and an outer photosensitive region. Inner photosensitive regions of pixels in an array may be provided with a respective local vertical transfer gate structure formed in a trench that laterally surrounds the inner photosensitive region. A trench structure may be formed in a grid-like pattern having gaps in which the nested sub-pixels are formed. The trench structure may be coupled to outer photosensitive regions of each of the pixels in the array. The trench structure may be a global vertical transfer gate structure. The vertical transfer gate structures provided to the pixels may allow for accumulated charges to be transferred to respective charge storage nodes associated with the photosensitive regions in any given pixel. Image sensors formed in this way may be used in rolling shutter or global shutter configurations.
An image sensor comprising:
A method of operating an image sensor having an array of image pixels, wherein each image pixel in the array of image pixels has an inner photosensitive region, an outer photosensitive region that surrounds the inner photosensitive region, and readout circuitry, the method comprising:
An image sensor, comprising:
Dependencies are inferred from the claim text.