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US 2019/0378829 A1Published application
Thermally enhanced package to reduce thermal interaction between dies
AssigneeGlobalfoundries Inc.
InventorsJanak PATEL, Subramanian Srikanteswara IYER, Daniel BERGER
Life of this patent
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Abstract
A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.
Claims20
A device comprising:
- plural integrated circuit (IC) chips attached to an upper surface of a substrate;
- a lid over the IC chips;
- and
- a slit through the lid at a boundary between adjacent IC chips.
1 more element
A device comprising:
- plural integrated circuit (IC) chips attached to an upper surface of a substrate, wherein the IC chips comprise a logic chip and at least one memory stack adjacent the logic chip;
- a lid over the IC chips;
- a slit through the lid at a boundary between the logic chip and each memory stack;
- and
- a heat sink over the lid.
2 more elements
Dependencies are inferred from the claim text.