US 2019/0378826 A1 · SEMICONDUCTOR PACKAGE

Abstract

A semiconductor package includes a first semiconductor package, a second semiconductor package on the first semiconductor package, and a plurality of connection terminals between the first semiconductor package and the second semiconductor package. The first semiconductor package may include a package substrate, a semiconductor chip on the package substrate and having a first surface and a second surface facing each other, the first surface being adjacent to the second semiconductor package, a plurality of connection pads between the first surface of the semiconductor chip and the connection terminals, and a molding layer on the package substrate and covering side surfaces of the semiconductor chip, the molding layer being spaced apart from the connection terminals.

Claims20

Dependent claims

A semiconductor package, comprising:

a first semiconductor package;
a second semiconductor package on the first semiconductor package;
and
a plurality of connection terminals between the first semiconductor package and the second semiconductor package, wherein:
the first semiconductor package includes:
a package substrate;
a semiconductor chip on the package substrate and having a first surface and a second surface facing each other, the first surface being adjacent to the second semiconductor package;
a plurality of connection pads between the first surface of the semiconductor chip and the connection terminals;
and
a molding layer on the package substrate and covering side surfaces of the semiconductor chip, the molding layer being spaced apart from the connection terminals.

7 more elements

Dependencies are inferred from the claim text.

Semiconductor package

Life of this patent

Semiconductor package

Life of this patent

Abstract

Claims20