Semiconductor package and method of manufacturing same

A method of manufacturing a semiconductor package, the method comprising:

• a) forming a resin coated film on a semiconductor chip and forming a re-distribution layer in contact with an electrode of the semiconductor chip on a part of an upper portion of the resin coated film;
• b) forming a passivation layer which is positioned on the resin coated film and is a thermal buffer layer, which exposes an upper central portion of the re-distribution layer, to have a thickness ranging from 7.5 to 50% of a diameter of a solder ball;
• c) forming an under bump metallization in contact with the re-distribution layer;
• and
• d) forming the solder ball which electrically connects the under bump metallization and a printed circuit board.

A method of manufacturing a semiconductor package comprising:

• a-1) forming a resin coated film, which is a thermal buffer layer, on a semiconductor chip to have a thickness ranging from 7.5 to 50% of a diameter of a solder ball and forming a re-distribution layer in contact with an electrode of the semiconductor chip on a part of an upper portion of the resin coated film;
• b-1) forming a passivation layer which is positioned on the resin coated film and is a thermal buffer layer which exposes an upper central portion of the re-distribution layer;
• c-1) forming an under bump metallization in contact with the re-distribution layer;
• and
• d-1) forming the solder ball which electrically connects the under bump metallization and a printed circuit board.