Wiring substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorsJunji SATO, Katsuya FUKASE
Life of this patent
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Abstract
A wiring substrate includes: a wiring member that includes a first surface and a second surface, the wiring member including a plurality of wiring layers between the first surface and the second surface; and a carrier that is bonded to the first surface via an adhesive and that includes a plurality of layers whose coefficients of thermal expansion are different from each other. A pitch of wires included in the plurality of wiring layers is narrower on the second surface side than on the first surface side. When being heated, a direction in which the wiring member tends to warp and a direction in which the carrier tends to warp are opposite.
Claims4
A wiring substrate comprising:
- a wiring member that includes a first surface and a second surface, the wiring member including a plurality of wiring layers between the first surface and the second surface;
- and
- a carrier that is bonded to the first surface via an adhesive and that includes a plurality of layers whose coefficients of thermal expansion are different from each other,
- wherein a pitch of wires included in the plurality of wiring layers is narrower on the second surface side than on the first surface side, and
- wherein, when being heated, a direction in which the wiring member tends to warp and a direction in which the carrier tends to warp are opposite.
Dependencies are inferred from the claim text.