Electronic component module

An electronic component module comprising:

• a substrate;
• electronic components mounted on the substrate, each of the electronic components having terminals located on a side surface, an upper surface, and/or a lower surface thereof;
• and
• a shield located on the substrate so as to cover the electronic components, the shield having an upper plate and one or more side plates, the shield being supplied with a ground potential, the upper plate being located above the electronic components, the one or more side plates extending from the upper plate toward the substrate and surrounding the electronic components,
• wherein in an electronic component closest to one side plate of the one or more side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side surface and/or the upper surface, of the electronic components, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal to which the ground potential is supplied, and a second distance of one or more second terminals, to which the ground potential is not supplied, of the at least one terminal to the one side plate is greater than the first distance.