Seal ring bonding structures
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsLieneng LOW, Teck Wee Christopher LIM, Wai Mun CHONG, Wan Tak NG
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Abstract
The present disclosure relates to semiconductor structures and, more particularly, to seal ring structures with channels and methods of manufacture. The structure includes: a first wafer having a channel formed within a passivation layer; a second wafer having a protuberance which is insertable into the channel and which is bonded to the first wafer with eutectic bonding materials; and a plurality of stoppers or tabs extending within the channel and which provides a gap that has a dimension smaller than a gap formed in other portions of the channel.
Claims20
A structure, comprising:
- a first wafer having a channel formed within a passivation layer;
- a second wafer having a protuberance which is insertable into the channel and which is bonded to the first wafer with eutectic bonding materials;
- and
- a plurality of stoppers or tabs extending within the channel and which provides a gap that has a dimension narrower than a gap formed in other portions of the channel.
A structure, comprising:
- a first wafer having a channel;
- a second wafer having a protuberance which is insertable into the channel;
- and
- a plurality of stoppers or tabs which narrow a gap in the channel and provide a mechanism to direct flow of eutectic encapsulation bonding material to a wider channel portion of the channel during a bonding process of the first wafer to the second wafer.
A method comprising:
- aligning a first wafer with a protuberance with a channel of a second wafer;
- and
- bonding the first wafer to the second wafer using eutectic bonding materials by subjecting the first wafer and the second wafer to a predetermined temperature and pressure such that eutectic bonding materials are prevented from overflowing from the channel by a narrow gap portion of the channel and are directed to flow into a wider gap portion of the channel.
Dependencies are inferred from the claim text.