Semiconductor device

A semiconductor device, comprising:

• a first island part,
• a first semiconductor chip mounted on the first island part,
• a second island part,
• a second semiconductor chip mounted on the second island part,
• a third island part,
• a third semiconductor chip mounted on the third island part,
• a fourth island part,
• a fourth semiconductor chip mounted on the forth island part,
• a fifth semiconductor chip mounted on the forth island part,
• a sixth semiconductor chip mounted on the forth island part,
• a fifth island part,
• a first driving semiconductor chip mounted on the fifth island part and connected to each of the first to third semiconductor chips,
• a sixth island part,
• a second driving semiconductor chip mounted on the sixth island part and connected to each of the fourth to sixth semiconductor chips,
• a first lead terminal connected to the first semiconductor chip by a first wire,
• a second lead terminal connected to the second semiconductor chip by a second wire,
• a third lead terminal connected to the third semiconductor chip by a third wire,
• a fourth lead terminal connected to the fourth semiconductor chip by a fourth wire,
• a fifth lead terminal connected to the fifth semiconductor chip by a fifth wire,
• a sixth lead terminal connected to the sixth semiconductor chip by a sixth wire, and
• a seventh lead terminal extending from the fourth island part,
• wherein the first to sixth semiconductor chips are arranged in a first direction in a row,
• the first lead terminal is longer than at least one of the second lead terminal and the third lead terminal in a second direction perpendicular to the first direction, and
• in a cross section along the first direction, a first groove is formed between the first semiconductor chip and the second semiconductor chip, and a second groove is formed between the second semiconductor chip and the third semiconductor chip.