Semiconductor device and method of manufacturing the same

A semiconductor device, comprising:

• a semiconductor chip having a connection electrode disposed on each of a front surface and a back surface;
• a first plate-shaped conductor portion electrically connected to the connection electrode on the back surface side of the semiconductor chip and disposed on the back surface side;
• a second plate-shaped conductor portion electrically connected to the connection electrode on the front surface side of the semiconductor chip and disposed on the front surface side;
• and
• a sealing body made of resin that covers each of the semiconductor chip and the first and second plate-shaped conductor portions;
• wherein the first plate-shaped conductor portion has a first electrode surface exposed on the back surface of the sealing body,
• the second plate-shaped conductor portion has a second electrode surface exposed on the front surface of the sealing body, a groove is formed along a portion of the first or second electrode surface of at least one of the front surface and the back surface of the sealing body in plan view, and
• a part of the first or second plate-shaped conductor portion is disposed on a lower portion or an upper portion of the groove.

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) mounting a semiconductor chip on a first plate-shaped conductor portion;
• (b) mounting a second plate-shaped conductor portion on the semiconductor chip after the step (a);
• (c) forming a sealing body made of resin to cover the first plate-shaped conductor portion, the semiconductor chip, and the second plate-shaped conductor portion after the step (b);
• (d) exposing a part of the second plate-shaped conductor portion on the front surface of the sealing body and exposing a part of the first plate-shaped conductor portion on the back surface of the sealing body after the step (c);
• wherein in the step (d), by irradiating a laser on at least one of the front surface and the back surface of the sealing body to expose a part of at least one of the first or second plate-shaped conductor portion from the sealing body.