Semiconductor device

A semiconductor device comprising:

• a semiconductor element including a semiconductor substrate, an element electrode and a wiring layer, the semiconductor substrate having a substrate main surface and a substrate rear surface that are spaced apart from each other in a first direction, the element electrode being formed on the substrate main surface, the wiring layer being formed on the substrate main surface and electrically connected to the element electrode;
• a lead frame supporting the semiconductor element;
• a conductive member electrically connecting the semiconductor element and the lead frame;
• and
• a sealing resin covering the semiconductor element, apart of the lead frame and the conductive member, wherein
• the wiring layer includes a rectangular plate-like member elongated in a second direction perpendicular to the first direction,
• the conductive member has a connecting portion bonded to the plate-like member, the connecting portion being elongated in a longitudinal direction of the plate-like member as viewed in the first direction and overlapping with a longitudinal center of the plat-like member as viewed in the first direction.