Heat-dissipating arrangement and method for the production thereof

A method for producing a heat dissipating assembly, wherein the heat dissipating assembly comprises at least one power module that contains a printed circuit board populated with components that need to be cooled, and at least one heat sink located on the printed circuit board and over the components that are to be cooled, wherein

• at least one thermally conductive element is placed on the printed circuit board on at least one of the components that are to be cooled, which extends away from the printed circuit board, in a first step, and the heat sink is located above of the components on the printed circuit board and the at least one thermally conductive element located thereon, wherein the thermally conductive element has a heat dissipating medium in its interior, or a heat dissipating medium is placed therein in or prior to the first step or in or after the second step, and/or
• the heat sink is placed on the components of the printed circuit board in an alternative first step or the second step, wherein at least one second thermally conductive element is integrated in the heat sink during the production of the heat sink, and a heat dissipating element is placed in the second and/or first thermally conductive element in another step.