Semiconductor package

Abstract

A semiconductor package may include a core member having first and second through-holes, a passive component disposed in the first through-hole of the core member, a semiconductor chip disposed in the second through-hole of the core member and having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a first encapsulant encapsulating at least a portion of the passive component and having a first thermal conductivity, a second encapsulant encapsulating at least a portion of the semiconductor chip and having a second thermal conductivity higher than the first thermal conductivity, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip.

Dependencies are inferred from the claim text.