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US 2019/0378772 A1Published application
Wiring substrate, electronic device, and electronic module
AssigneeKYOCERA Corporation
InventorHiroshi KAWAGOE
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes an insulating substrate being square in plan view, the insulating substrate including one main surface with a recess, and the other main surface opposite to the one main surface, and external electrodes located on the other main surface of the insulating substrate. The external electrodes are arranged in a row in a peripheral section of the insulating substrate. In plan view, an area of one of the external electrodes located at a center of each side of the insulating substrate is larger than an area of one of the external electrodes located at an edge of the each side.
Claims14
A wiring substrate comprising:
- an insulating substrate comprising one main surface with a recess, and an other main surface opposite to the one main surface, the insulating substrate being square in plan view of the one main surface;
- and
- a plurality of external electrodes located in a row in a peripheral section of the other main surface of the insulating substrate, wherein
- in plan view of the other main surface, an area of one of the external electrodes located at a center of each side of the insulating substrate is larger than an area of one of the external electrodes located at an edge of the each side.
1 more element
Dependencies are inferred from the claim text.