Method and apparatus for multiple direct transfers of semiconductor devices

An apparatus for executing a direct transfer of one or more semiconductor device die from a wafer tape to a substrate, the apparatus comprising:

• a product substrate frame to secure the substrate, the product substrate frame having a first side and a second side;
• a die substrate frame to secure the wafer tape holding multiple semiconductor device die, the die substrate frame being disposed adjacent to the first side of the product substrate frame;
• a transfer mechanism disposed adjacent to the die substrate frame to transfer a semiconductor device die from the wafer tape when the wafer tape is secured in the die substrate frame, the transfer mechanism including a plurality of transfer pins;
• and
• a guide to position the plurality of transfer pins at specific locations in a matrix configuration, the guide maintaining the matrix configuration of the plurality of transfer pins throughout a transfer operation.