Mask-integrated surface protective tape, and method of producing a semiconductor chip using the same

A method of separating a semiconductor wafer into a plurality semiconductor chips using a mask-integrated surface protective tape that includes a mask material layer and a substrate film, wherein the mask material layer is attached directly to the substrate film, or is attached to the substrate film through a temporary-adhesive layer interposed therebetween, the method comprising:

• laminating the mask-integrated surface protective tape on a patterned top surface of a semiconductor wafer with the mask material layer in direct contact with the patterned top surface of the semiconductor wafer;
• grinding a bottom surface of the semiconductor wafer that is opposite to the patterned surface to thin the semiconductor wafer from a bottom thereof while protecting the patterned top surface by the laminated mask-integrated surface protective tape;
• laminating a wafer-fixing tape on the ground bottom surface of the semiconductor wafer;
• thereafter, attaching the wafer-fixing tape to a frame so as to support the ground semiconductor wafer via the frame;
• thereafter, peeling off the substrate film, or the substrate film and the temporary-adhesive layer, from the mask-integrated surface protective tape so as to expose a surface of the mask material layer;
• radiating a laser beam along prescribed dicing lines to the exposed surface of the mask material layer to laser-cut the mask material layer along the prescribed dicing lines, thereby patterning the mask material layer;
• thereafter, exposing the semiconductor wafer having the patterned mask material layer thereon to a plasma to perform a plasma dicing of the semiconductor wafer using the patterned mask material layer as a mask;
• removing the mask material layer;
• and
• separating the diced semiconductor wafer from the wafer-fixing tape so as to produce a plurality of separated semiconductor chips.