Method of manufacturing semiconductor device and cleaning apparatus

A method of manufacturing a semiconductor device, comprising the steps of:

• preparing a semiconductor wafer having a front surface, a back surface opposite to the front surface, and a first central axis perpendicular to the front surface and the back surface, and having an interlayer insulating film formed on the front surface;
• forming a conductive material on the interlayer insulating film,
• after forming the conductive material, cleaning the semiconductor wafer;
• and
• after cleaning the semiconductor wafer, forming a photoresist, wherein,
• the cleaning step including the steps of:
• preparing a cleaning apparatus having a pen-type brush having a first rotation mechanism by a first motor, a second rotation mechanism by a second motor, a second central axis, and an end face perpendicular to the second central axis rotating the semiconductor wafer around the first central axis by the first rotation mechanism, and
• rotating the pen-type brush around the second central axis and contacting the end face with the front surface by the second rotation mechanism,
• and,
• an abnormality in the cleaning step is detected based on an electric current from the second motor.

A cleaning apparatus, comprising:

• a first rotation mechanism having a first motor and rotating the semiconductor wafer around the first central axis perpendicular to the front surface;
• a roller brush having a second central axis and an outer peripheral surface and configured so as to be capable of the outer peripheral surface contacting with and separating from the front surface;
• a second rotation mechanism having a second motor and rotating the roller brush around the second central axis;
• and
• an abnormality detector detecting abnormality of the second rotation mechanism based on an electric current from the second motor, wherein
• the abnormality detector is configured so as to be detect the abnormality of the second rotation mechanism by comparing a threshold value with a difference value that is a difference of the electric current from the second motor between in a state that the outer peripheral surface is separated from the front surface and in a state that the outer peripheral surface is contacted with the front surface.

A cleaning apparatus, comprising:

• a first rotation mechanism having a first motor and rotating the semiconductor wafer around the first central axis perpendicular to the front surface;
• a pen-type brush having a second central axis and an end face perpendicular to the second central axis and configured so as to be capable of the end face contacting with and separating from the front surface;
• a second rotation mechanism having a second motor and rotating the pen-type brush around the second central axis;
• and
• an abnormality detector detecting abnormality of the second rotation mechanism based on an electric current from the second motor, wherein
• the abnormality detector is configured so as to be detect the abnormality of the second rotation mechanism by comparing a threshold value with a difference value that is a difference of the electric current from the second motor between in a state that the end face is separated from the front surface and in a state that the end face is contacted with the front surface.