Deposition guard plate and sputtering device

Abstract

A sputtering device includes a vacuum chamber, a target, a substrate stage, and a deposition guard plate. The target is located in the vacuum chamber. The substrate stage is located in the vacuum char and includes a seat surface on which a substrate is placed. The substrate includes an outer circumferential portion extending beyond the seat surface. The deposition guard plate is located in the vacuum chamber and includes an annular inclined surface extending around the substrate stage. The annular inclined surface is faced toward the target and is a circumferential surface of a truncated cone including an inner edge opposing a rear surface of the outer circumferential portion. An angle between the annular inclined surface and a plane including the seat surface is greater than or equal to 10° and less than or equal to 50°.

Dependencies are inferred from the claim text.