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US 2019/0378695 A1Published application
Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorSatoshi Suzuki
Life of this patent
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Abstract
A technique capable of suppressing transmission of heat is provided. A support includes a first surface placed at a vacuum space of a processing vessel which is set to be in a vacuum atmosphere and a second surface placed at a non-vacuum space of the processing vessel. The support is provided with a groove formed, on the second surface, between a low-temperature region having a relatively low temperature and a high-temperature region having a relatively high temperature when a substrate processing is performed.
Claims9
A substrate processing apparatus, comprising:
- a processing vessel whose inside is set to be in a vacuum atmosphere when a substrate processing is performed;
- and
- a sealing member having a first surface placed at a vacuum space of the processing vessel which is set to be in the vacuum atmosphere and a second surface placed at a non-vacuum space of the processing vessel, the sealing member being provided with a groove formed, on the second surface, between a low-temperature region having a relatively low temperature and a high-temperature region having a relatively high temperature when the substrate processing is performed, the sealing member being configured to seal the processing vessel.
Dependencies are inferred from the claim text.