Pattern Measuring Method, Pattern Measuring Tool and Computer Readable Medium

A pattern measuring tool that includes a beam irradiation subsystem, which irradiates a wafer with a beam and thus generates an output in response to a signal from the wafer, and a computer subsystem, wherein

• the computer subsystem:
• receives the signal obtained by irradiating the wafer with the beam using the pattern measuring tool;
• measures a width between a first pattern and another pattern formed on the wafer and identifies a value corresponding to a signal amount between the first pattern and the other pattern, based on reception of the signal;
• and
• calculates height information from a portion between the first pattern and the other pattern to an upper portion of a pattern based on the measured width between the first pattern and the other pattern and the value corresponding to the signal amount between the first pattern and the other pattern.

A non-transitory computer-readable medium that stores program instructions executable on a computer system of a pattern measuring tool so as to perform a method that is implemented by a computer that measures a pattern formed on a wafer, wherein

• the method that is implemented by the computer includes:
• receiving a signal obtained by irradiating the wafer with a beam using the pattern measuring tool;
• measuring a width between a first pattern and another pattern formed on the wafer and identifying a value corresponding to a signal amount between the first pattern and the other pattern, based on reception of the signal;
• and
• calculating height information from a portion between the first pattern and the other pattern to an upper portion of a pattern based on the measured width between the first pattern and the other pattern and the value corresponding to the signal amount between the first pattern and the other pattern.