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US 2019/0378657 A1Published application
Multiple layer cylindrical capacitor
AssigneeQUALCOMM Incorporated
InventorsYe LU, Junjing BAO, Bin YANG
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Abstract
Aspects generally relate to multilayer capacitor structures formed in vias in a substrate of an integrated circuit. The multilayer cylindrical capacitor includes multiple cylindrical conductive layers formed in the via and separated by multiple cylindrical insulating layers between the plurality of cylindrical conductive layers. The cylindrical conductive layers form plates of the multilayer cylindrical capacitor.
Claims24
A multilayer cylindric capacitor comprising:
- a substrate;
- a via formed in the substrate;
- a first cylindrical conductive layer formed on an inner surface of the via;
- a first cylindrical insulating layer formed on an inner surface of the first cylindrical conductive layer;
- a second cylindrical conductive layer formed on an inner surface of the first cylindrical insulating layer
- a second cylindrical insulating layer formed on an inner surface of the second cylindrical conductive layer;
- and
- a third cylindrical conductive layer formed on an inner surface of the second cylindrical insulating layer.
5 more elements
A multilayer cylindric capacitor comprising:
- a substrate;
- a via formed in the substrate;
- a plurality of cylindrical conductive layers and a plurality of cylindrical insulating layer formed inside the via;
- wherein the plurality of cylindrical conductive layers are separated by the plurality of cylindrical insulating layers.
1 more element
A method of fabricating a multilayer cylindric capacitor comprising:
- forming a via on a substrate;
- forming a plurality of cylindrical conductive layers and a plurality of cylindrical insulating layer formed inside the via;
- wherein the plurality of cylindrical conductive layers are separated by the plurality of cylindrical insulating layers.
Dependencies are inferred from the claim text.