Multilayer ceramic capacitor and manufacturing method of the same

A manufacturing method of a multilayer ceramic capacitor comprising:

• forming a ceramic multilayer structure having a parallelepiped shape in which each of a plurality of ceramic dielectric green sheets and each of a plurality of conductive pastes for forming an internal electrode are alternately stacked and the each of the plurality of conductive pastes is alternately exposed to two end faces of the ceramic multilayer structure;
• coating a metal paste on the two end faces, the metal paste contacting to the two end faces, the metal paste including metal powder and a Mo source, a main component of the metal powder being a metal or an alloy including at least one of Ni and Cu;
• forming a multilayer chip from the ceramic multilayer structure and ground layers from the metal paste, by firing the ceramic multilayer structure on which the metal paste is coated;
• and
• forming external electrodes, each of which includes each of the ground layers and a plated layer, by performing plating with respect to the ground layers,
• wherein “M≥0.003185×(Ew×Et)−0.5921 is satisfied when, in the multilayer chip, “Et” is a height from a bottom one of the internal electrode layers to a top one of the internal electrode layers in a stacking direction, “Ew” is a width of the internal electrode layers in a direction in which side faces of the multilayer chip face with each other, and “M” is a Mo concentration (atm %) with respect to a main component ceramic of a total of the multilayer chip and the external electrodes.