Plated product and method of manufacturing the same
AssigneeCheng Uei Precision Industry Co., Ltd.
InventorsCHIU-HSIEN YANG, QI-WEN XIAO, PENG LI
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Abstract
A plated product includes a component and an overall layer plated on a surface of the component. The overall layer includes a copper layer, a nickel layer, a nickel-tungsten layer, an inner golden layer, a palladium layer, an outer golden layer and a rhodium-ruthenium layer. The copper layer is plated on a surface of the component. The nickel layer, the nickel-tungsten layer, the inner golden layer, the palladium layer, the outer golden layer and the rhodium-ruthenium layer are plated on a surface of the copper layer in sequence.
Claims10
A plated product, comprising:
- a component;
- and
- an overall layer plated on a surface of the component, the overall layer including a copper layer, a nickel layer, a nickel-tungsten layer, an inner golden layer, a palladium layer, an outer golden layer and a rhodium-ruthenium layer, the copper layer being plated on a surface of the component, the nickel layer, the nickel-tungsten layer, the inner golden layer, the palladium layer, the outer golden layer and the rhodium-ruthenium layer being plated on a surface of the copper layer in sequence.
A plated product, comprising:
- a component;
- and
- an overall layer plated on a surface of the component, the overall layer including a copper layer, a nickel layer, a nickel-tungsten layer, an inner golden layer, a palladium layer, an outer golden layer and a rhodium-ruthenium layer, the copper layer being plated on a surface of the component, the nickel layer, the nickel-tungsten layer, the inner golden layer, the palladium layer, the outer golden layer and the rhodium-ruthenium layer being plated on a surface of the copper layer in sequence;
- wherein a total thickness of the overall layer is ranged between 2.4 μm and 17.5 μm.
A method of manufacturing a plated product, comprising:
- preparing a component;
- plating a copper layer on a surface of the component;
- plating a nickel layer on a surface of the copper layer;
- plating a nickel-tungsten layer on a surface of the nickel layer;
- plating an inner golden layer on a surface of the nickel-tungsten layer;
- plating a palladium layer on a surface of the inner golden layer;
- plating an outer golden layer on a surface of the palladium layer;
- and
- plating a rhodium-ruthenium layer on a surface of the outer golden layer.
Dependencies are inferred from the claim text.