Post exposure processing apparatus

A process chamber, comprising:

• a chamber body defining a process volume, wherein a major axis of the process volume is oriented vertically and a minor axis of the process volume is oriented horizontally;
• a door coupled to the chamber body;
• a first electrode coupled to the door, the first electrode configured to support a substrate thereon;
• a first plurality of fluid ports formed in a sidewall of the chamber body adjacent the process volume;
• and
• a second plurality of fluid ports formed in the sidewall of the chamber body adjacent the process volume opposite the first plurality of fluid ports;
• and
• a power source communicatively coupled to the first electrode.

A substrate processing method, comprising:

• positioning a substrate on a first electrode within a process volume;
• moving the first electrode to a process position adjacent a second electrode disposed within the process volume;
• introducing a process fluid into the process volume between the first electrode and the second electrode, the process fluid introduced at a rate between 5 L/min and 10 L/min;
• and
• generating an electric field between the first electrode and the second electrode and applying the electric field to the substrate via the process fluid, the electric field having a strength between about 1 kV/m and about 2 MV/m.