Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device

An actinic ray-sensitive or radiation-sensitive resin composition comprising:

• a resin having an acid-decomposable group whose polarity increases through decomposition by the action of an acid;
• an acid generator A capable of generating a first acid upon irradiation with actinic rays or radiation;
• and
• an acid generator B capable of generating a second acid upon irradiation with actinic rays or radiation,
• wherein the second acid is capable of decomposing the acid-decomposable group and has a larger pKa than the first acid, and
• in a case where a decomposition reaction rate of the acid-decomposable group by the first acid is defined as k0 and a decomposition reaction rate of the acid-decomposable group by the second acid is defined as k′0, k′0/k0 is more than 0.05 and 0.90 or less,
• provided that k0 and k′0 are determined as follows:
• an actinic ray-sensitive or radiation-sensitive resin film having a film thickness T formed by applying an actinic ray-sensitive or radiation-sensitive resin composition including the resin, a test acid generator A which is an onium salt including an anion of the first acid and a triphenylsulfonium cation, and a solvent onto a substrate is subjected to exposure at 99 positions while increasing an exposure dose from 1 mJ/cm2 with an interval of 0.3 mJ/cm2 using an ArF excimer laser, the film after the exposure is subjected to a baking treatment at 90° C. for 60 seconds, and the film thickness after the exposure treatment is calculated;
• thereafter, the film is subjected to a development treatment with butyl acetate for 30 seconds and the film thickness of the film after the development treatment at each exposed position is calculated;
• points corresponding to the film thickness and the exposure dose after the development treatment at each exposed position are plotted in an orthogonal coordinate having the film thicknesses on the vertical axis and the exposure doses on the horizontal axis, a line obtained by connecting the plotted points is created, and coordinates E0.4 and E0.8 on the horizontal axis at points where the vertical axes on the line become Film thickness T×0.4 and Film thickness T×0.8, respectively, are each calculated;
• next, points corresponding to the film thickness and the exposure dose after the exposure treatment at each exposed position are plotted in an orthogonal coordinate having the film thicknesses on the vertical axis and the exposure doses on the horizontal axis, a line obtained by connecting the plotted points is created, and an absolute value of an inclination of a straight line obtained by connecting points at which the horizontal axes on the line become E0.4 and E0.8, respectively, is taken as k0;
• and
• next, k′0 is determined by the same calculation method as k0 using an actinic ray-sensitive or radiation-sensitive resin film having a film thickness T formed by applying an actinic ray-sensitive or radiation-sensitive resin composition including the resin, a test acid generator B which is an onium salt including an anion of the second acid and a triphenylsulfonium cation, and a solvent onto a substrate, and k′0/k0 is calculated.