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US 2019/0377143 A1Published application
Electronic device and method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorsKazuaki TSUCHIYAMA, Motoo SUWA, Ryuichi OIKAWA
Life of this patent
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Abstract
A performance of an electronic device is improved. An optical transceiver (electronic device) includes a semiconductor device electrically connected to a transmission line. In this semiconductor device, a resistor is arranged between a wiring electrically connected to the transmission line and a semiconductor chip having a semiconductor laser formed therein.
Claims20
An electronic device comprising:
- a first semiconductor chip having a driving circuit for driving a semiconductor laser formed therein;
- a transmission line electrically connected to the first semiconductor chip;
- and
- a semiconductor device electrically connected to the transmission line,
- wherein the semiconductor device includes:
- a wiring electrically connected to the transmission line;
- a resistor connected to the wiring;
- and
- a second semiconductor chip having a semiconductor laser formed therein that is electrically connected to the resistor.
6 more elements
A method of manufacturing an electronic device including:
- a first semiconductor chip having a driving circuit for driving a semiconductor laser formed therein;
- a transmission line electrically connected to the first semiconductor chip;
- and
- a semiconductor device electrically connected to the transmission line,
- the semiconductor device including:
- a wiring electrically connected to the transmission line;
- a resistor connected to the wiring;
- and
- a second semiconductor chip having a semiconductor laser formed therein that is electrically connected to the resistor,
- the method comprising the steps of:
- (a) manufacturing the semiconductor device;
- (b) preparing a mounting substrate having the transmission line formed therein;
- (c) preparing a semiconductor component including the first semiconductor chip;
- (d) mounting the semiconductor device over the mounting substrate so that the semiconductor device and the transmission line are electrically connected to each other;
- and
- (e) mounting the semiconductor component over the mounting substrate so that the semiconductor component and the transmission line are electrically connected to each other.
13 more elements
Dependencies are inferred from the claim text.