Back to results
US 2019/0377142 A1Published application
Fiber-less photonic system in an integrated package
AssigneeUniversity College Cork
InventorPeter O'Brien
Life of this patent
Estimating the term…
Abstract
The invention provides a photonic package system comprising at least two optical alignment pins integrated on a package substrate. A key feature of this invention is the addition of alignment structures within the package. When combined with the use of micro optics it enables a ‘fiber-less’ photonic package system that requires no physical connection between and optical fiber and the photonic package system.
Claims12
A photonic package system comprising:
- a substrate layer;
- at least two optical alignment pins integrated on the substrate layer and protruding from the substrate layer;
- a photonic device positioned and aligned with respect to the two pins;
- and
- an optical device configured to receive an optical signal and aligned with respect to the two pins.
2 more elements
A method of making a photonic package system comprising the steps of:
- providing a substrate layer;
- integrating at least two optical alignment pins on the substrate layer and protruding from the substrate layer;
- positioning a photonic device with respect to the two pins;
- and
- aligning an optical device and configured to receive an optical signal with respect to the two alignment pins.
2 more elements
Dependencies are inferred from the claim text.