Integrated circuit authentication from a die material measurement

A computer-readable storage medium comprising instructions that, when executed by a processor, cause the processor to perform acts comprising:

• measuring a signal generated by an integrated circuit (IC), wherein the signal is generated by an electrical circuit formed in a first die incorporated in the IC, the first die having a label indicating that the first die is cut from a particular location in a first wafer;
• comparing the measured signal with a reference value, wherein the reference value is derived from a plurality of reference dies each sourced from a respective wafer, wherein each of the reference dies is cut from a common location in its respective wafer that corresponds to the location from which the first die is labelled as being cut from the first wafer;
• and
• responsive to determining that the measured signal has a value within a predefined range of the reference value, outputting an indication that the die is sourced from the location indicating by the label;
• and
• responsive to determining that the measured signal has a value that is not within the predefined range of the reference value, outputting an indication that the die is not sourced from the location indicated by the label.

A method comprising:

• receiving an electrical signal from a test circuit incorporated in an integrated circuit (IC), the test circuit formed on a die that is indicated as being cut from a wafer at a first location on the wafer;
• comparing a value of a property of the electrical signal to a reference value indicative of an expected value of the property, the reference value selected for the comparing based upon the die being indicated as being cut from the wafer at the first location;
• and
• outputting an indication that the die is cut from the first location based upon the value of the property being within a predefined range of the reference value.