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US 2019/0376865 A1Published application
Pressure Sensor
AssigneeTyco Electronics AMP Korea Co., Ltd.
InventorsYoung Deok Kim, Won Jong Choi
Life of this patent
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Abstract
A pressure sensor includes a sensor element, an inner frame configured to receive at least a portion of the sensor element, and a housing configured to receive the inner frame therein. The inner frame is formed of a metal material and includes a printed circuit board assembly to be electrically connected to the sensor element. The housing is formed of a resin material.
Claims20
A pressure sensor, comprising:
- a sensor element;
- an inner frame configured to receive at least a portion of the sensor element, the inner frame formed of a metal material and including a printed circuit board assembly to be electrically connected to the sensor element;
- and
- a housing configured to receive the inner frame therein and formed of a resin material.
1 more element
Dependencies are inferred from the claim text.