A method for manufacturing a thermally conductive cover for a piping system, the thermally conductive cover comprising:
- a first thermal conductor for covering the piping system, the first thermal conductor being formed of metal and including a first surface on which a first hole is formed;
- a second thermal conductor for, coupled with the first thermal conductor, covering the piping system, the second thermal conductor being formed of metal, including a second surface on which a second hole is formed, the second surface opposing to the first surface;
- and
- a coupling member including a first inserted part to be inserted into the first hole and a second inserted part to be inserted into the second hole, a force to fix the first inserted part to the first hole is greater than a force to fix the second inserted part to the second hole,
- the method comprising
- attaching the coupling member to the first thermal conductor by inserting the first inserted part into the first hole such that the second inserted part protrudes from the first surface, the second inserted part being elastically deformable in a direction perpendicular to an inserting direction of the first inserted part.